Customization: | Available |
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Metal Coating: | Copper |
Mode of Production: | SMT&Pth&BGA&DIP&Box Buliding |
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Lines | 9(5 Yamaha,4 KME) |
Capacity | 52 million placements per month |
Max Board Size | 457*356mm.(18"X14") |
Min Component size | 01015. 4 sq.mm.(0.084 sq.inch),long connector,CSP,BGA,QFP |
Min.pin space of IC | 0.3mm |
Min. space of BGA | 0.3mm |
Max.precision of IC assembly | ±0.03mm |
Speed | 0.15 sec/chip,0.7 sec/QFP |
Max board width | 400 mm |
Type | Dual wave |
Pbs status | Lead-free line support |
Max temp | 399 degree |
Spray flux | add-on |
Pre-heat | 3 |
DIP capacity | ≥100k parts/day |